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IMO - IMOMEC

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BASIC FAILURE MECHANISMS/ INTERCONNECT RELIABILITY

Back-end reliability such as electromigration is assessed within IMO-IMOMEC’s reliability group.

 

Specifically designed test structures allow assessing reliability in single and dual inlaid metal lines.  Different test methodologies, ranging from fast wafer-level testing  to high-resolution testing on packaged samples, are at our disposal. The introduction of Cu/low-k damascene technology in the back-end-of-line has lead to a completely new approach on metal line reliability