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UHV MAGNETRON SPUTTER DEPOSITION SYSTEM

 

Sputter deposition is a physical vapor deposition process for depositing thin films, where the target material is ejected by ion bombardment and deposited onto the substrate. Target materials that are available at IMO-IMOMEC are Al, B, Cr, Ni, Si, Ta, Ti, W. Using additional gasses (N2, O2) during the sputtering process compound materials can by achieved (e.g. AlN, BN, TiN, Si3N4, Al2O3, etc.). Magnetron sputtering can be done either in DC-pulsed or RF modes. Additionally, during the process substrate can be heated up to 1200°C by the heated substrate stage.