Wire bonding is the primary method of making small interconnections on the millimeter and micrometer scale. The IMO-IMOMEC is equipped with a MEI 1204W hybrid wedge wire bonder. The technique is quite popular in the research field; wire bonding can be used to electrically connect various very small research samples to rather large electronic devices. It is a cost-effective and flexible interconnect technology. Wedge bonding can be performed with either aluminum or gold, with only the latter requiring heat. The welding of the wire is done by using some combination of heat, pressure, and ultrasonic energy. The main advantage of wedge wire bonding is its applicability on a high variety of substrates such as bonding polymers and deposited metals on diamond, graphene flakes, oxides and nitrides to printed circuit boards or ceramic packages for electronic readout.