Project R-13295

Development of an innovative multiparameter sensing platform based on integrated impedance and thermal sensors for the screening of interface phenomena and changes in bulk liquid for lab-on-chip applications. (Research)

Multi-device synchronous measurement and thus a fusion of data from multiple and potentially heterogeneous sensor sources is becoming a fundamental but non-trivial task. This project aims to expand the possibilities of multi-parameter sensing by integrating impedance and thermal sensors into one format for the simultaneous assessment of electrical and thermal properties. This combination would allow for simultaneous monitoring of physical and/or chemical interactions at the interface of the sensor or within the bulk liquid by performing advanced data processing or modifying the measuring protocol. The sensor will use a modified transient plane source measuring principle to monitor thermal changes and interdigitated electrodes for impedance analysis. In the project, finite-element multi-physics simulations, combined with equivalent electrical and thermal models, will serve as tools for designing, characterizing, and testing the sensor. These devices will be fabricated and tested in real-life. Both a microfluidic and well-plate format will be explored. Different proof-of-applications will be considered during the project to demonstrate the broad application potential from the sensor technique. In that sense, the project works to develop a generic sensor measurement platform independent of the application. By valorizing this technology platform, one can further explore different vertical pillars, working towards a more dedicated sensor for a specific application.

01 November 2022 - 31 October 2024